A silicon-proven interoperable PDK

By Rich Morse, SpringSoft & Tom Quan, TSMC
EDADesignline.com
March 5, 2010

On July 21, 2009, TSMC announced the availability of the industry's first interoperable process design kit (iPDK).

The kit was fully validated on TSMC's 65 nanometer (nm) MS/RF process and all major EDA vendors announced their support, including Cadence, Ciranova, Magma, Mentor, SpringSoft, Synopsys, and others.

On March 24, 2010, the Interoperable PDK Libraries (IPL) Alliance of which TSMC is a member, released the IPL 1.0 standard, and made the underlying technology for the TSMC iPDK available to the entire industry.

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